git.gag.com Git - hw/telebt/blob - Datasheets/ti-chipcon/swrr073/Readme.txt

   1 XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX\r
   2 X       Artwork and documentation done by:                                      X\r
   3 X                                                                       X\r
   4 X       TEXAS INSTRUMENTS NORWAY LPW                                            X\r
   5 X                                                                       X\r
   6 X       Address: Gaustadalléen 21    0349 OSLO                                                  X\r
   7 X       Phone  : (+47) 22 95 85 44   Fax :  (+47) 22 95 89 05                                   X\r
   8 X       web: www.ti.com/lpw                                                     X\r
   9 X                                                                                                       X\r
  10 XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX\r
  11 \r
  12 PCB NAME : CC2540EM discrete    \r
  13 REVISION: 1.5.1\r
  14 DATE: 2010-04-27\r
  15 \r
  16 PCB DESCRIPTION:4 LAYER PCB 1.6 MM\r
  17       Copper        1   35 um\r
  18       Dielectric  1-2   0.35 mm (e.g. 2x Prepreg 7628 AT05 47% Resin)\r
  19       Copper        2   18 um\r
  20       Dielectric  2-3   0.76 mm (4 x 7628M 43% Resin)\r
  21       Copper        3   18 um\r
  22       Dielectric  3-4   0.35 mm (e.g. 2x Prepreg 7628 AT05 47% Resin)\r
  23       Copper        4   35 um\r
  24 \r
  25   DE104iML or equivalent substrate (Resin contents around 45%, which gives Er=4.42@2.4GHz, TanD=0.016)\r
  26   Dimensions in mil (0.001 inch)\r
  27   DOUBLE SIDE SOLDER MASK,\r
  28   DOUBLE SIDE SILKSCREEN,\r
  29   8 MIL MIN TRACE WIDTH AND 8 MIL MIN ISOLATION.\r
  30         \r
  31 ASSEMBLY:       LABEL CARD WITH "CC2540EM_D_R1.5.1"\r
  32 \r
  33 FILE: CC2540EM_Discrete_1_5_1.ZIP PACKED WITH WinZIP containing \r
  34                  \r
  35 FILE NAME                                       DESCRIPTION                                                     FILE TYPE\r
  36 \r
  37 PCB MANUFACTURING FILES:\r
  38 L1.SPL                                          LAYER 1 COMPONENT SIDE/POSITIVE                         EXT. GERBER\r
  39 L2.SPL                                  LAYER 2 POSITIVE                                                    EXT. GERBER\r
  40 L3.SPL                                          LAYER 3 POSITIVE                                                    EXT. GERBER\r
  41 L4.SPL                                  LAYER 4 SOLDER SIDE/POSITIVE                            EXT. GERBER\r
  42 STOPCOMP.SPL                            SOLDER MASK COMPONENT SIDE/NEGATIVE                     EXT. GERBER\r
  43 STOPSOLD.SPL                            SOLDER MASK SOLDER SIDE/NEGATIVE                        EXT. GERBER\r
  44 SILKCOMP.SPL                            SILKSCREEN COMPONENT SIDE/POSITIVE              EXT. GERBER\r
  45 SILKSOLD.SPL                            SILKSCREEN SOLDER SIDE/POSITIVE                 EXT. GERBER\r
  46 GERBER.REP                              DRILL and NC DRILL REPORT                               ASCII\r
  47 DRILL.SPL                                       DRILL/MECHANICAL DRAWING                                EXT. GERBER\r
  48 NCDRILL.SPL                             NC DRILL THROUGH HOLE                                   EXCELLON                        \r
  49 EXT_GERBER.USR                          PCB PHOTOPLOTTER DEFINITION FILE                        ASCII\r
  50 CNC.USR                                 NC DRILL DEVICE FILE                            ASCII\r
  51 \r
  52 PCB ASSEMBLY FILES:\r
  53 CC2540EM_DISCRETE_PARTLIST.XLS          PART LIST                                       ASCII\r
  54 P_P_COMP.REP                                  PICK AND PLACE COORDINATES, COMPONENT SIDE        ASCII\r
  55 P_P_SOLD.REP                                  PICK AND PLACE COORDINATES, SOLDER SIDE           ASCII\r
  56 PASTCOMP.SPL                            SOLDER PASTE COMPONENT SIDE                             EXT. GERBER\r
  57 PASTSOLD.SPL                            SOLDER PASTE SOLDER SIDE                        EXT. GERBER\r
  58 ASSYCOMP.SPL                            ASSEMBLY DRAWING COMPONENT SIDE                         EXT. GERBER\r
  59 ASSYSOLD.SPL                            ASSEMBLY DRAWING SOLDER SIDE                    EXT. GERBER\r
  60 \r
  61 PDF FILES:\r
  62 CC2540EM_DISCRETE_SCHEMATIC.PDF CIRCUIT DIAGRAM\r
  63 CC2540EM_DISCRETE_LAYOUT.PDF            LAYOUT DIAGRAM\r
  64 \r
  65 CADSTAR FILES:\r
  66 CC2540EM_DISCRETE.SCM                   CADSTAR SCHEMATIC FILE\r
  67 CC2540EM_DISCRETE.PCB                   CADSTAR LAYOUT FILE\r
  68 \r
  69 README.TXT                              THIS FILE                                                       ASCII\r
  70 \r
  71 END.\r
  72 \r
  73 Release history\r
  74 --------------------------------------------------------------------------------------------------------------\r
  75 1.0.0 : Initial release.\r
  76 1.1.0 : Based on CC2530EM_Discrete_1.3.1. New rounting of power and decoupling of VCO/PA supply with 2 caps in common (pin 27,28 and 29).\r
  77            New configuration of components for opamp test.\r
  78            Connected pin 1 and 2 of X1 to GND\r
  79            Connected pin 2 of P2 to GND\r
  80            New QFN40_RHa package with TI recommended footprint.\r
  81 1.2.0 : Removed opamp and comparator test pads.\r
  82           Fiducialmarks without solder paste.\r
  83           SMA connector with extended pads, and new posisition.\r
  84           Added T-filter at output to resuce TX harmonics.\r
  85           Revision for test purpose.\r
  86 1.3.0: 4 layer design and serial inductors on IOs to combat VCO leakage.\r
  87 1.4.0: Reduced inductor count to 9 6n8.\r
  88 1.5.0: Removed all I/O inductors.\r
  89 1.5.1: Updated 32 MHz crystal with correct name.\r
  90          Changed C231 and C221 to 12 pF\r
  91 \r
  92 \r
  93 \r