X-Git-Url: https://git.gag.com/?p=web%2Fgag.com;a=blobdiff_plain;f=pcb%2Fpaste%2Findex.mdwn;fp=pcb%2Fpaste%2Findex.mdwn;h=61d69f2c098c72758c52b2826c56fd3914f3aabe;hp=0000000000000000000000000000000000000000;hb=c75e0810cdbfef24da254fe984eddcede48f6c29;hpb=d2c9aab2960878276b765311601581c49f62e563 diff --git a/pcb/paste/index.mdwn b/pcb/paste/index.mdwn new file mode 100644 index 0000000..61d69f2 --- /dev/null +++ b/pcb/paste/index.mdwn @@ -0,0 +1,13 @@ +# Paste Station + +After [laser engraving](../laser/) serial numbers on each board image in an +assembly panel, the next step in our process is to apply solder paste to all +of the pads on each board that we intend to populate with surface mount +components. + +Initially, this was done "by hand" using a frameless stencil on a desktop +with bits of scrap PCB to form a frame and bits of masking tape to hold +things in place. However, we've got a clever idea about how to do this +better without investing in an expensive solder-paste stenciling machine. + +More details to come...