From: Bdale Garbee <bdale@gag.com>
Date: Tue, 10 Dec 2019 01:36:14 +0000 (-0700)
Subject: quick notes about what parts Bdale through-hole loads on v2.1 boards
X-Git-Tag: fab-v3.0p1~4
X-Git-Url: https://git.gag.com/?p=hw%2Ftelelco;a=commitdiff_plain;h=6f796fd5ad32c2d7f52085fa82693cff9ecae8fa

quick notes about what parts Bdale through-hole loads on v2.1 boards
---

diff --git a/Notebook b/Notebook
index 0cc1128..ca976e1 100644
--- a/Notebook
+++ b/Notebook
@@ -16,3 +16,15 @@ less engineering margin than we usually like.
 
 Changing the circuit to be powered from v_lipo with the gpio hooked to shdn*
 and controlling a FET switch on the output might be smarter someday?
+
+2019.12.09
+- what gets through-hole soldered on to a v2.1 board (sans optics)
+
+	6-pin micromatch with locking ears
+	2 * 9-pin screw terminal strips
+	5x1 100mil straight header
+	beeper
+	LiPo connector
+	edge-launched SMA
+	2x1 100mil right-angle header
+