From: Keith Packard <keithp@keithp.com>
Date: Thu, 6 Sep 2012 07:29:45 +0000 (-0700)
Subject: Bump to version 0.2
X-Git-Tag: fab-v2.0~51
X-Git-Url: https://git.gag.com/?p=hw%2Ftelelco;a=commitdiff_plain;h=6ba3a7eb4af3ad2d6e0ff2f8f8cc0f11f968c489

Bump to version 0.2

Signed-off-by: Keith Packard <keithp@keithp.com>
---

diff --git a/telelco.pcb b/telelco.pcb
index 081b34b..bbddbaa 100644
--- a/telelco.pcb
+++ b/telelco.pcb
@@ -6,7 +6,7 @@ FileVersion[20070407]
 PCB["TeleLco" 450000 375000]
 
 Grid[100.0 0 0 0]
-Cursor[0 18200 0.000000]
+Cursor[42000 375000 0.000000]
 PolyArea[200000000.000000]
 Thermal[0.500000]
 DRC[500 1000 500 500 1500 650]
@@ -2667,7 +2667,7 @@ Layer(3 "outline")
 )
 Layer(4 "silk")
 (
-	Text[174974 316200 2 100 "TeleLco v0.1" "onsolder"]
+	Text[174974 316200 2 100 "TeleLco v0.2" "onsolder"]
 	Text[190100 326200 2 100 "` 2012 Keith Packard" "onsolder"]
 	Text[197400 336200 2 100 "Licensed under the TAPR OHL" "onsolder"]
 	Text[179188 346228 2 100 "tapr.org/OHL" "onsolder"]
diff --git a/telelco.sch b/telelco.sch
index 06878fe..0c2362e 100644
--- a/telelco.sch
+++ b/telelco.sch
@@ -7,7 +7,7 @@ vendor_part_number=MMA7260QT-ND
 T 13300 -8600 8 10 0 1 0 0 1
 vendor_part_number=MCP9700-E/TO-ND
 T 102300 40400 9 10 1 0 0 0 1
-0.1
+0.2
 T 99900 40400 9 10 1 0 0 0 1
 1
 T 100500 40400 9 10 1 0 0 0 1