Bump to version 0.2

[hw/telelco] / telelco.pcb

diff --git a/telelco.pcb b/telelco.pcb
index 081b34b16ff89e0dd4639a210a7515560822709d..bbddbaa492e11175f95f9c374d919e9e9a01d9b3 100644 (file)
--- a/telelco.pcb
+++ b/telelco.pcb
@@ -6,7 +6,7 @@ FileVersion[20070407]
 PCB["TeleLco" 450000 375000]
 
 Grid[100.0 0 0 0]
-Cursor[0 18200 0.000000]
+Cursor[42000 375000 0.000000]
 PolyArea[200000000.000000]
 Thermal[0.500000]
 DRC[500 1000 500 500 1500 650]
@@ -2667,7 +2667,7 @@ Layer(3 "outline")
 )
 Layer(4 "silk")
 (
-       Text[174974 316200 2 100 "TeleLco v0.1" "onsolder"]
+       Text[174974 316200 2 100 "TeleLco v0.2" "onsolder"]
        Text[190100 326200 2 100 "` 2012 Keith Packard" "onsolder"]
        Text[197400 336200 2 100 "Licensed under the TAPR OHL" "onsolder"]
        Text[179188 346228 2 100 "tapr.org/OHL" "onsolder"]