quick notes about what parts Bdale through-hole loads on v2.1 boards

[hw/telelco] / Notebook

diff --git a/Notebook b/Notebook
index 0cc11283591154a580a4a2be10a5dead1c858039..ca976e17c3bf1d997f1e8fe44fe365841e62fb16 100644 (file)
--- a/Notebook
+++ b/Notebook
@@ -16,3 +16,15 @@ less engineering margin than we usually like.
 
 Changing the circuit to be powered from v_lipo with the gpio hooked to shdn*
 and controlling a FET switch on the output might be smarter someday?
+
+2019.12.09
+- what gets through-hole soldered on to a v2.1 board (sans optics)
+
+       6-pin micromatch with locking ears
+       2 * 9-pin screw terminal strips
+       5x1 100mil straight header
+       beeper
+       LiPo connector
+       edge-launched SMA
+       2x1 100mil right-angle header
+