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(parent: 19d0498) | patch
Move components away from cc115 corners
authorKeith Packard <keithp@keithp.com>
Thu, 21 Mar 2013 15:04:24 +0000 (08:04 -0700)
committerKeith Packard <keithp@keithp.com>
Thu, 21 Mar 2013 15:04:24 +0000 (08:04 -0700)
commitb214e5ef1b1517a63adf124023d5091b7ceb5e46
treef67b58da62fbef55886fe4c51c8d2ff2b5f57f60tree | snapshot
parent19d0498dc5229c7174649ef86784c98933b3b280commit | diff
Move components away from cc115 corners

The chip overlaps most of the pads, so move stuff away from the area
between the corner pads. Also reflood the ground between the cc115 and
the PA to provide better thermal conductivity.

Signed-off-by: Keith Packard <keithp@keithp.com>
telegps.pcb diff | blob | history
GPS telemetry board