From: Keith Packard <keithp@keithp.com>
Date: Tue, 1 Jul 2014 23:10:23 +0000 (-0700)
Subject: Update nx3215sa xtal footprint to use suggested land pattern
X-Git-Tag: telelco-v3.0~774^2
X-Git-Url: https://git.gag.com/?a=commitdiff_plain;h=44ce3f6591137c0574eb258898f9066b54e5ed4d;p=hw%2Faltusmetrum

Update nx3215sa xtal footprint to use suggested land pattern

The package pads are 0.75 x 1.3 mm, but the data sheet suggests a pad
size of 1.0 x 1.8mm to ensure sufficient solder around, I assume.

Signed-off-by: Keith Packard <keithp@keithp.com>
---

diff --git a/packages/nx3215sa.5c b/packages/nx3215sa.5c
index a62d8de..ee2f808 100644
--- a/packages/nx3215sa.5c
+++ b/packages/nx3215sa.5c
@@ -21,9 +21,9 @@ import Footprint;
 real package_width = 3.20;
 real package_height = 1.50;
 
-real pad_width = 0.75;
-real pad_height = 1.30;
-real pad_space = 1.70+0.75;
+real pad_width = 1.0;
+real pad_height = 1.8;
+real pad_space = 1.50+1.0;
 
 element_start("cx1vsm");