From: Keith Packard <keithp@keithp.com>
Date: Tue, 1 Oct 2019 06:30:11 +0000 (-0700)
Subject: Include test plan in package for seeed
X-Git-Url: https://git.gag.com/?a=commitdiff_plain;h=3e03a948c6d342c0f3d6ce77f2f60b18700baf0a;p=hw%2Fmicropeak

Include test plan in package for seeed

Signed-off-by: Keith Packard <keithp@keithp.com>
---

diff --git a/Makefile b/Makefile
index cd167a4..1398c09 100644
--- a/Makefile
+++ b/Makefile
@@ -10,4 +10,6 @@ LAYERS=2
 # sides with silkscreen, can be none|top|bottom|both
 SILK=both
 
+SEEED_EXTRA=MicroPeak-Test-Plan.doc
+
 include ../altusmetrum/pcb-rnd.mk