copper improvements to ensure solid ground connections at top of board

diff --git a/quantistrand.lht b/quantistrand.lht
index 118189a02fd7d73d8bf61dfaf8170d8a73782c12..9eaf9074fcad1f575baa779933cdd8dd74516b05 100644 (file)
--- a/quantistrand.lht
+++ b/quantistrand.lht
@@ -4416,14 +4416,14 @@ ha:pcb-rnd-board-v8 {
    text_scale = 100
    clearance = 10.0mil
   }
-  {ha:oh wow}                                                                                                                                                                                                                                                                                                                                                                                                           {
+  {ha:oh wow}                                                                                                                                                                                                                                                                                                                                                                                                            {
    via_proto = 3
    thickness = 100.0mil
    text_thick = 0.0
    text_scale = 100
    clearance = 20.0mil
   }
-   {ha:mega amps}                                                      {
+   {ha:mega amps}                                                       {
     thickness = 225.0mil
     text_thick = 0.0
     text_scale = 100
@@ -4433,12 +4433,12 @@ ha:pcb-rnd-board-v8 {
  li:pcb-rnd-conf-v1 {
   ha:overwrite {
    ha:design {
-    via_proto = 2
+    via_proto = 4
     text_font_id = 0
     text_scale = 100
     min_slk = 0.12700000 mm
     text_thickness = 0
-    line_thickness = 60.00 mil
+    line_thickness = 10.00 mil
     poly_isle_area = 200000000.0
     ha:drc {
      min_ring = 7.0 mil
@@ -4446,7 +4446,7 @@ ha:pcb-rnd-board-v8 {
     }
     min_wid = 0.12700000 mm
     bloat = 0.12700000 mm
-    clearance = 10.00 mil
+    clearance = 6.00 mil
    }
    ha:editor {
     grids_idx = 1
@@ -4845,6 +4845,25 @@ ha:pcb-rnd-board-v8 {
              li:thermal {
              }
             }
+            ha:padstack_ref.1854535 {
+             proto=4; x=265.0mil; y=50.0mil; rot=0.000000; xmirror=0; smirror=0; clearance=6.0mil;
+             ha:flags {
+              clearline=1
+             }
+
+             li:thermal {
+               li:2 {
+                on  
+                solid  
+                noshape  
+               }
+               li:3 {
+                on  
+                solid  
+                noshape  
+               }
+             }
+            }
             ha:subc.1849930 {
              ha:attributes {
               refdes=Z1
@@ -8492,13 +8511,13 @@ ha:pcb-rnd-board-v8 {
       }
      }
      ha:line.1852961 {
-      x1=900.0mil; y1=750.0mil; x2=965.0mil; y2=685.0mil; thickness=10.0mil; clearance=12.0mil;
+      x1=900.0mil; y1=750.0mil; x2=957.0mil; y2=693.0mil; thickness=10.0mil; clearance=12.0mil;
       ha:flags {
        clearline=1
       }
      }
      ha:line.1852964 {
-      x1=965.0mil; y1=685.0mil; x2=965.0mil; y2=325.0mil; thickness=10.0mil; clearance=12.0mil;
+      x1=957.0mil; y1=693.0mil; x2=957.0mil; y2=222.0mil; thickness=10.0mil; clearance=12.0mil;
       ha:flags {
        clearline=1
       }
@@ -8558,13 +8577,7 @@ ha:pcb-rnd-board-v8 {
       }
      }
      ha:line.1853185 {
-      x1=935.0mil; y1=200.0mil; x2=965.0mil; y2=230.0mil; thickness=10.0mil; clearance=12.0mil;
-      ha:flags {
-       clearline=1
-      }
-     }
-     ha:line.1853188 {
-      x1=965.0mil; y1=230.0mil; x2=965.0mil; y2=324.0mil; thickness=10.0mil; clearance=12.0mil;
+      x1=935.0mil; y1=200.0mil; x2=957.0mil; y2=222.0mil; thickness=10.0mil; clearance=12.0mil;
       ha:flags {
        clearline=1
       }