quick notes about what parts Bdale through-hole loads on v2.1 boards

[hw/telelco] / Notebook

diff --git a/Notebook b/Notebook
index a83143555991d982404efe84794e02eb74dfa8c6..ca976e17c3bf1d997f1e8fe44fe365841e62fb16 100644 (file)
--- a/Notebook
+++ b/Notebook
@@ -11,7 +11,20 @@ connect all of them to pin 4, the gpio driving the circuit.
 
 The net effect is that we're making 12V from the gpio, which means all the LED
 current and switcher inefficiency is coming as current through that gpio.  The
-measured LED current is around 7mA, so this is "safe" for the SOC, but really
-not a great plan... 
+measured LED current is around 7mA, so this is "safe" for the SOC, but leaves
+less engineering margin than we usually like.
+
+Changing the circuit to be powered from v_lipo with the gpio hooked to shdn*
+and controlling a FET switch on the output might be smarter someday?
+
+2019.12.09
+- what gets through-hole soldered on to a v2.1 board (sans optics)
+
+       6-pin micromatch with locking ears
+       2 * 9-pin screw terminal strips
+       5x1 100mil straight header
+       beeper
+       LiPo connector
+       edge-launched SMA
+       2x1 100mil right-angle header
 
-Need to redesign this in the future to use a transistor/FET switch.