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+XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX\r
+X Artwork and documentation done by: X\r
+X X\r
+X TEXAS INSTRUMENTS NORWAY LPW X\r
+X X\r
+X Address: Gaustadalléen 21 0349 OSLO X\r
+X Phone : (+47) 22 95 85 44 Fax : (+47) 22 95 89 05 X\r
+X web: www.ti.com/lpw X\r
+X X\r
+XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX\r
+\r
+PCB NAME : CC2540EM discrete \r
+REVISION: 1.5.1\r
+DATE: 2010-04-27\r
+\r
+PCB DESCRIPTION:4 LAYER PCB 1.6 MM\r
+ Copper 1 35 um\r
+ Dielectric 1-2 0.35 mm (e.g. 2x Prepreg 7628 AT05 47% Resin)\r
+ Copper 2 18 um\r
+ Dielectric 2-3 0.76 mm (4 x 7628M 43% Resin)\r
+ Copper 3 18 um\r
+ Dielectric 3-4 0.35 mm (e.g. 2x Prepreg 7628 AT05 47% Resin)\r
+ Copper 4 35 um\r
+\r
+ DE104iML or equivalent substrate (Resin contents around 45%, which gives Er=4.42@2.4GHz, TanD=0.016)\r
+ Dimensions in mil (0.001 inch)\r
+ DOUBLE SIDE SOLDER MASK,\r
+ DOUBLE SIDE SILKSCREEN,\r
+ 8 MIL MIN TRACE WIDTH AND 8 MIL MIN ISOLATION.\r
+ \r
+ASSEMBLY: LABEL CARD WITH "CC2540EM_D_R1.5.1"\r
+\r
+FILE: CC2540EM_Discrete_1_5_1.ZIP PACKED WITH WinZIP containing \r
+ \r
+FILE NAME DESCRIPTION FILE TYPE\r
+\r
+PCB MANUFACTURING FILES:\r
+L1.SPL LAYER 1 COMPONENT SIDE/POSITIVE EXT. GERBER\r
+L2.SPL LAYER 2 POSITIVE EXT. GERBER\r
+L3.SPL LAYER 3 POSITIVE EXT. GERBER\r
+L4.SPL LAYER 4 SOLDER SIDE/POSITIVE EXT. GERBER\r
+STOPCOMP.SPL SOLDER MASK COMPONENT SIDE/NEGATIVE EXT. GERBER\r
+STOPSOLD.SPL SOLDER MASK SOLDER SIDE/NEGATIVE EXT. GERBER\r
+SILKCOMP.SPL SILKSCREEN COMPONENT SIDE/POSITIVE EXT. GERBER\r
+SILKSOLD.SPL SILKSCREEN SOLDER SIDE/POSITIVE EXT. GERBER\r
+GERBER.REP DRILL and NC DRILL REPORT ASCII\r
+DRILL.SPL DRILL/MECHANICAL DRAWING EXT. GERBER\r
+NCDRILL.SPL NC DRILL THROUGH HOLE EXCELLON \r
+EXT_GERBER.USR PCB PHOTOPLOTTER DEFINITION FILE ASCII\r
+CNC.USR NC DRILL DEVICE FILE ASCII\r
+\r
+PCB ASSEMBLY FILES:\r
+CC2540EM_DISCRETE_PARTLIST.XLS PART LIST ASCII\r
+P_P_COMP.REP PICK AND PLACE COORDINATES, COMPONENT SIDE ASCII\r
+P_P_SOLD.REP PICK AND PLACE COORDINATES, SOLDER SIDE ASCII\r
+PASTCOMP.SPL SOLDER PASTE COMPONENT SIDE EXT. GERBER\r
+PASTSOLD.SPL SOLDER PASTE SOLDER SIDE EXT. GERBER\r
+ASSYCOMP.SPL ASSEMBLY DRAWING COMPONENT SIDE EXT. GERBER\r
+ASSYSOLD.SPL ASSEMBLY DRAWING SOLDER SIDE EXT. GERBER\r
+\r
+PDF FILES:\r
+CC2540EM_DISCRETE_SCHEMATIC.PDF CIRCUIT DIAGRAM\r
+CC2540EM_DISCRETE_LAYOUT.PDF LAYOUT DIAGRAM\r
+\r
+CADSTAR FILES:\r
+CC2540EM_DISCRETE.SCM CADSTAR SCHEMATIC FILE\r
+CC2540EM_DISCRETE.PCB CADSTAR LAYOUT FILE\r
+\r
+README.TXT THIS FILE ASCII\r
+\r
+END.\r
+\r
+Release history\r
+--------------------------------------------------------------------------------------------------------------\r
+1.0.0 : Initial release.\r
+1.1.0 : Based on CC2530EM_Discrete_1.3.1. New rounting of power and decoupling of VCO/PA supply with 2 caps in common (pin 27,28 and 29).\r
+ New configuration of components for opamp test.\r
+ Connected pin 1 and 2 of X1 to GND\r
+ Connected pin 2 of P2 to GND\r
+ New QFN40_RHa package with TI recommended footprint.\r
+1.2.0 : Removed opamp and comparator test pads.\r
+ Fiducialmarks without solder paste.\r
+ SMA connector with extended pads, and new posisition.\r
+ Added T-filter at output to resuce TX harmonics.\r
+ Revision for test purpose.\r
+1.3.0: 4 layer design and serial inductors on IOs to combat VCO leakage.\r
+1.4.0: Reduced inductor count to 9 6n8.\r
+1.5.0: Removed all I/O inductors.\r
+1.5.1: Updated 32 MHz crystal with correct name.\r
+ Changed C231 and C221 to 12 pF\r
+\r
+\r
+\r
projects / hw / telebt / blobdiff