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-XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX\r
-X Artwork and documentation done by: X\r
-X X\r
-X TEXAS INSTRUMENTS NORWAY LPW X\r
-X X\r
-X Address: Gaustadalléen 21 0349 OSLO X\r
-X Phone : (+47) 22 95 85 44 Fax : (+47) 22 95 89 05 X\r
-X web: www.ti.com/lpw X\r
-X X\r
-XXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXXX\r
-\r
-PCB NAME : CC2540EM discrete \r
-REVISION: 1.5.1\r
-DATE: 2010-04-27\r
-\r
-PCB DESCRIPTION:4 LAYER PCB 1.6 MM\r
- Copper 1 35 um\r
- Dielectric 1-2 0.35 mm (e.g. 2x Prepreg 7628 AT05 47% Resin)\r
- Copper 2 18 um\r
- Dielectric 2-3 0.76 mm (4 x 7628M 43% Resin)\r
- Copper 3 18 um\r
- Dielectric 3-4 0.35 mm (e.g. 2x Prepreg 7628 AT05 47% Resin)\r
- Copper 4 35 um\r
-\r
- DE104iML or equivalent substrate (Resin contents around 45%, which gives Er=4.42@2.4GHz, TanD=0.016)\r
- Dimensions in mil (0.001 inch)\r
- DOUBLE SIDE SOLDER MASK,\r
- DOUBLE SIDE SILKSCREEN,\r
- 8 MIL MIN TRACE WIDTH AND 8 MIL MIN ISOLATION.\r
- \r
-ASSEMBLY: LABEL CARD WITH "CC2540EM_D_R1.5.1"\r
-\r
-FILE: CC2540EM_Discrete_1_5_1.ZIP PACKED WITH WinZIP containing \r
- \r
-FILE NAME DESCRIPTION FILE TYPE\r
-\r
-PCB MANUFACTURING FILES:\r
-L1.SPL LAYER 1 COMPONENT SIDE/POSITIVE EXT. GERBER\r
-L2.SPL LAYER 2 POSITIVE EXT. GERBER\r
-L3.SPL LAYER 3 POSITIVE EXT. GERBER\r
-L4.SPL LAYER 4 SOLDER SIDE/POSITIVE EXT. GERBER\r
-STOPCOMP.SPL SOLDER MASK COMPONENT SIDE/NEGATIVE EXT. GERBER\r
-STOPSOLD.SPL SOLDER MASK SOLDER SIDE/NEGATIVE EXT. GERBER\r
-SILKCOMP.SPL SILKSCREEN COMPONENT SIDE/POSITIVE EXT. GERBER\r
-SILKSOLD.SPL SILKSCREEN SOLDER SIDE/POSITIVE EXT. GERBER\r
-GERBER.REP DRILL and NC DRILL REPORT ASCII\r
-DRILL.SPL DRILL/MECHANICAL DRAWING EXT. GERBER\r
-NCDRILL.SPL NC DRILL THROUGH HOLE EXCELLON \r
-EXT_GERBER.USR PCB PHOTOPLOTTER DEFINITION FILE ASCII\r
-CNC.USR NC DRILL DEVICE FILE ASCII\r
-\r
-PCB ASSEMBLY FILES:\r
-CC2540EM_DISCRETE_PARTLIST.XLS PART LIST ASCII\r
-P_P_COMP.REP PICK AND PLACE COORDINATES, COMPONENT SIDE ASCII\r
-P_P_SOLD.REP PICK AND PLACE COORDINATES, SOLDER SIDE ASCII\r
-PASTCOMP.SPL SOLDER PASTE COMPONENT SIDE EXT. GERBER\r
-PASTSOLD.SPL SOLDER PASTE SOLDER SIDE EXT. GERBER\r
-ASSYCOMP.SPL ASSEMBLY DRAWING COMPONENT SIDE EXT. GERBER\r
-ASSYSOLD.SPL ASSEMBLY DRAWING SOLDER SIDE EXT. GERBER\r
-\r
-PDF FILES:\r
-CC2540EM_DISCRETE_SCHEMATIC.PDF CIRCUIT DIAGRAM\r
-CC2540EM_DISCRETE_LAYOUT.PDF LAYOUT DIAGRAM\r
-\r
-CADSTAR FILES:\r
-CC2540EM_DISCRETE.SCM CADSTAR SCHEMATIC FILE\r
-CC2540EM_DISCRETE.PCB CADSTAR LAYOUT FILE\r
-\r
-README.TXT THIS FILE ASCII\r
-\r
-END.\r
-\r
-Release history\r
---------------------------------------------------------------------------------------------------------------\r
-1.0.0 : Initial release.\r
-1.1.0 : Based on CC2530EM_Discrete_1.3.1. New rounting of power and decoupling of VCO/PA supply with 2 caps in common (pin 27,28 and 29).\r
- New configuration of components for opamp test.\r
- Connected pin 1 and 2 of X1 to GND\r
- Connected pin 2 of P2 to GND\r
- New QFN40_RHa package with TI recommended footprint.\r
-1.2.0 : Removed opamp and comparator test pads.\r
- Fiducialmarks without solder paste.\r
- SMA connector with extended pads, and new posisition.\r
- Added T-filter at output to resuce TX harmonics.\r
- Revision for test purpose.\r
-1.3.0: 4 layer design and serial inductors on IOs to combat VCO leakage.\r
-1.4.0: Reduced inductor count to 9 6n8.\r
-1.5.0: Removed all I/O inductors.\r
-1.5.1: Updated 32 MHz crystal with correct name.\r
- Changed C231 and C221 to 12 pF\r
-\r
-\r
-\r
projects / hw / telebt / blobdiff