Move power via out from under SoC. Fix copper around new holes
authorKeith Packard <keithp@keithp.com>
Tue, 29 Mar 2016 21:50:02 +0000 (14:50 -0700)
committerKeith Packard <keithp@keithp.com>
Tue, 29 Mar 2016 21:50:02 +0000 (14:50 -0700)
commiteb845da2454a36c7376f79f36676a11d5789a4aa
tree4b20006f866fc116975c955f2af2dc386953157e
parentc4b50e0bd7505dc9dc063e31128593ff15a8d422
Move power via out from under SoC. Fix copper around new holes

Signed-off-by: Keith Packard <keithp@keithp.com>
telemini.pcb