From: Bdale Garbee <bdale@gag.com>
Date: Fri, 17 Feb 2012 21:55:46 +0000 (-0800)
Subject: don't try to ground the pad underneath high-g accel, we only solder it to get
X-Git-Tag: fab-v0.1~28
X-Git-Url: https://git.gag.com/?p=hw%2Ftelemega;a=commitdiff_plain;h=23023a539fa0971a29e730dc45eb62454e0b933b

don't try to ground the pad underneath high-g accel, we only solder it to get
better mechanical adhesion!
---

diff --git a/megametrum.sch b/megametrum.sch
index 2076da7..dc94aef 100644
--- a/megametrum.sch
+++ b/megametrum.sch
@@ -900,7 +900,6 @@ value=MMA6556
 N 48700 71000 48600 71000 4
 N 48600 71000 48600 68900 4
 N 48700 69000 48600 69000 4
-N 48700 69400 48600 69400 4
 N 48700 69800 48600 69800 4
 N 48700 70200 48600 70200 4
 C 46600 72600 1 0 0 3.3V-plus.sym