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Move components away from cc115 corners
author
Keith Packard
<keithp@keithp.com>
Thu, 21 Mar 2013 15:04:24 +0000
(08:04 -0700)
committer
Keith Packard
<keithp@keithp.com>
Thu, 21 Mar 2013 15:04:24 +0000
(08:04 -0700)
The chip overlaps most of the pads, so move stuff away from the area
between the corner pads. Also reflood the ground between the cc115 and
the PA to provide better thermal conductivity.
Signed-off-by: Keith Packard <keithp@keithp.com>
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